Minnotek Introduces a New Expandable & Modularized Rugged System – DS-A6
TAIPEI, TAIWAN, (December 28th, 2012) – a Global Embedded Solution provider. Minnotek is unveiling a new Expandable & Modularized Rugged System – DS-A6.
Focusing on routers, factory automation, control systems and industrial transportation applications, DS-A6 is easy to extend by connecting IET (Intelligent Expansion Technology) expansion module and support Multi-COM Isolation, Multi-LAN Bypass and Multi-LAN POE Module.
DS-A6 is powered by Intel ® Atom™ D2550 Dual-Core processor and Intel® NM10 Express Chipset, which consumes low power and is energy-efficient. TPD is lower than 10 watts for processor and 12.1 watts while computer is running on full power. It supports one 204-pin DDR3 SODIMM up to 4GB DDR3 800/ 1066 SDRAM. The rich I/O deployment includes 1 VGA, 1LAN, 1 SIM card slot, 1 Swappable 2.5” Drive Bay, 1 12-bit GPIO, 1 SMBUS, 2COM, 2 PS/2 for KB & MS, 3USB and 2 knockouts antenna mountings.
Here come some unique characteristics of Minnotek’s DS-A6:
DS-A6 is an expandable & modularized rugged system, users can choose CPU and chipset according to application needs or budget control (ODM projects by conditional). With IET expansion modules via daughter boards through sockets, DS-A6 is flexible for future I/O expansion and upgrades.
Flexible IET (Intelligent Expansion Technology) Expansion Modules
IET interface is a concept positioned to connecting Single Board Computers and Computers On Modules. IET expansion modules help deliver efficient scheduling, allow less development resources and provide system integrators a cost-effective solution. By connecting IET expansion modules via daughter boards through sockets, DS-A6 can easily be extended with Multi-COM (AUX-M01), Multi-LAN Bypass (AUX-M02), Multi-LAN POE (AUX-M04) and Multi-COM Isolation (AUX-M07) modules.
Quick OEM design Saving Time to Market
DS-A6 expansion modules come with over 80-90% standard parts, it features easy assembly and easy maintenance. It helps reduce inventory, control budget and improves the turnover rate of raw materials. When customization is needed, DS-A6’s IET expansion modules are made to support any level of customization based on consumer request.
Realibity and Stability
DS-A6 is cable less, fully-equipped with IC Onboard capability and provides small footprint which increase system stability and environmental tolerance. It is certified by industrial product quality tests, including anti-vibration (continuous vibrations) of up to 5 Grms, and anti-shock of up to 50 Grms tests. Also withstand industrial operation environments of temperature between -10 to 60°C. Supports a stable +12~+28V wide voltage input, with anti-interference capability and protects computer from overload short circuits.
User Friendly Design
Front access swappable 2.5” Drive Bay, SSD and SIM card slot, helps easy maintenance and friendly use. A service window is also available to easily access mSATA, Mini-PCIe and DRAM.
DS-A6 Main Features:
- Onboard Intel® Atom™ D2550 1.86GHz CPU
- Intel® NM10 Express Chipset
- One 204-pin SODIMM Up to 4GB DDR3 1066 SDRAM
- Rich I/O, 1 VGA, 1 LAN, 1 SIM Slot, 1 Swappable 2.5” Derive Bay, 1 Audio, 1 12-bit GPIO, 1 SMBUS, 2 COM, 2 PS/2 for KB & MS, 2 Knockouts Antenna Mounting, 3 USB
- IET Expansion Supporting Multi-COM (AUX-M01), Multi-LAN Bypass (AUX-M02), Multi-LAN POE (AUX-M04) and Multi-COM Isolation (AUX-M07)
- Rugged Design for Vibration & Shock Protection, Cable-less Design
- Fanless Operation from -10 ~ 60°C
- Wide Range DC Power Input from 12 ~ 28
Minnotek Inc is a leading provider of advanced industrial and embedded computing platforms. Committed to innovative engineering. Minnotek provides integrated solutions, hardware and services for premier OEM/ODMs and system integrators worldwide. Reliable and high quality computing platforms include industrial systems, displays, rugged tablets, medical tablet, medical panel, bedside infotainment, digital signage etc. Minnotek also offers customized end-to-end services from initial product conceptualization and product development to volume manufacturing and after-sales service program.